| Layer | 1-40L | 1-32L |
| Thickness | 0.5-17.5mm | 0.5-17.5mm |
| Min Machine Via | 0.1mm | 0.1mm |
| Min Laser Via | 3mil | 3mil |
| HDI Range | 1+n+1、2+n+2、3+n+3 | 1+n+1、2+n+2、3+n+3 |
| Min. Line/Track space | 3/3mil | 3/3mil |
| Impedance control | +/-5% | +/-5% |
| Max Copper Thickness | 12oz | 12oz |
| Max thickness aperture ratio | 0.750694 | 0.750694 |
| Max Size | 650mm X 1130mm | 650mm X 1130mm |
| Material | FR4/Hi-Tg/Rogers/Halogen Free/RCC/PTFE/Nelco/Mixed Stack-Up Material |
| Surface Finishing | HASL, HASL PB FREE, Immersion Gold/Tin/Silver, Gold Finger Plating, OSP, Immersion Gold+OSP |
| Special Process | Buried blind vias, stepped grooves, metal substrates, embedded resistors, embedded capacitors, mixed stack, flex-rigid board, back drilling, stepped gold fingers, etc. |